EnviroEtch (TM)
EnviroEtch (TM) provides a method
of continuously etching the top surface of flat
substrates, quickly and efficiently. Designed for
post-diffusion etching of oxide from the surface of solar
cells, this revolutionary system accepts belt-to-belt
transfer of wafers eliminating the need for operator
involvement or transfer to carriers. Vapor-phase
etching significantly minimizes acid usage, and
contamination from suspended particulates. This
system provides effective, inexpensive, and rapid removal
of oxide from silicon substrates.
The EnviroEtch (TM) consists of three
stages:
1) Etch stage. The etch stage exposes
the top surface of sustrates to vaporized HF effectively
removing oxide down to the substrate surface.
2) Wash stage. Reaction by-products
are rinsed and removed.
3) Dryer stage. Front and back side
water is removed, completely drying wafers before they
exit the process.
If
you have any further questions, or would like a quote,
please contact us at:
sales@enviroetch.com